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As electronic product designs have moved to more densely packed PWBs with fine lines and spacing, double-sided surface-mount technology, fine-pitch components, ball grid arrays (BGAs), chip-scale packages (CSPs), stacked packages, etc, the role of the soldering flux has become a critical link in the chain of events required for a successful manufacturing process In the past, the soldering process was usually followed by a cleaning step to remove flux residues and to ensure the reliability of the assembly This practice was challenged in the early 1990s by the elimination of a major class of cleaning materials, which had been used for flux residue removal The targeted cleaning agents include chlorofluorocarbons (CFCs) and methyl chloroform (1,1,1 trichloroethane) that have been shown to destroy stratospheric ozone.

1 These were replaced by aqueous detergent cleaners and saponifying agents, and in some cases cleaning was eliminated by the use of low solids or no-clean fluxes Up to the mid-1970s, the predominant flux chemistry was rosin-based Today, although rosin fluxes are still in use, great advances have been made in flux chemistries and a large variety of formulations with very different chemistries are being used The implementation by the European Parliament of Directive 2002/95/EC on the restriction of the use of certain hazardous substances (Restriction of Hazardous Substances [RoHS]) in electrical and electronic equipment, including lead in solder, has had significant.

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h y 3 5 10 4 075 3 = 18 10 4 in z = o = 00046 mm 275 075 l This design highlights the difficulty in making slot-fed bearings The accurate manufacturing of such fine slots requires the utmost precision and is often prohibitively expensive Moving the slots closer to the ends of the bearing eases the manufacturing constraint A similar procedure can be

impact upon the manufacturing process. Traditional tin-lead solder melts at 183 C, whereas the most common lead-free alternatives have a much higher melting temperature, including tin-copper (227 C), tin-silver (221 C), and tin-silver-copper (217 C). This affects the substrate materials, the flux formulations, the cleaning materials and processes, among other things. This chapter will review the assembly, soldering, and cleaning processes, briefly touch on choice of surface finishes for both printed boards and components, discuss the soldering flux in terms of its role in soldering, review the variety of flux chemistries available along with their advantages and disadvantages, and comment on the challenges for flux formulation and cleaning due to lead-free soldering temperatures.

;ledswich.asm ;4 LEDs on PORTB, 4 switches on PORTD ;PORTD0 SWITCH - > PORTB0 LED ;PORTD1 SWITCH - > PORTB1 LED ;PORTD2 SWITCH - > PORTB2 LED ;PORTD3 SWITCH - > PORTB3 LED ;Press one or more switches and corresponding LEDs will lightup ;assembled using Atmel s avrasm assembler. ;the following .inc file should be placed in the same directory as ;this assembly program .include 1200def.inc .cseg .org 0 rjmp RESET ;Reset Handle rjmp RESET rjmp RESET RESET: ldi r16, 0b11111111 ;load register r16 with all 1 s out DDRB, r16 ;configure PORT B for all outputs ldi r16, 0b00000000 ;load register r16 with all 0 s out DDRD, r16 ;configure PORTD for all inputs loopit: in r16, PIND ;read the state of the pin on PORTD ;into r16 register out PORTB, r16 ;and copy it to PORTB rjmp loopit

The basic elements of an electronic assembly are the PWB, the components and the interconnecting metallization. The majority of PWBs are made of epoxy-glass substrate with copper or solder-coated copper metallization. In many cases, a solder mask covers most of the circuit traces, leaving exposed only those patterns where soldering will occur during assembly. Boards designed for through-hole components usually contain copper-plated through holes that may be solder-coated; those designed for surface-mount components will have metallized pads for interconnecting the surface-mount parts to form the assembly.

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