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Assembly Process Issues The assembly process for electronics includes wave soldering, reflow soldering, and vapor phase soldering as well as selective soldering. Components range from through-hole and surface-mount BGA, m-BGA, CSP, and stacked packages to chip-on-board (COB). The high density and reduced size of today s electronics has led to system-in-a-package (SIP), where the integrated circuit (IC) package contains several active devices, and system-on-achip (SOC), where all the functions of an electronic system are integrated on a single chip. These package types increase the complexity of the electronic assembly process, requiring adhesive attachment for bottom-side discretes, underfill for CSP, wirebonding and encapsulation for COB, and solder paste, paste flux, and liquid flux for various applications. When manufacturing complex printed wiring assemblies (PWAs), the thermal process chosen must take into account the thermal mass of the assembly, the component density, the solder flux and solder paste characteristics, and the maximum temperature limitation of the components. Most of the components assembled to the board in the soldering process have a maximum temperature of 240 C for traditional Sn/Pb soldering. Some electronic components, such as electrolytic capacitors and plastic-encapsulated components, are not rated to experience the high temperatures required to process with lead-free solders. The resulting heatinduced degradation can result in early field failures. Also, the higher temperatures required for lead-free solders are not compatible with many optoelectronic components. The increased heat can cause a variety of conditions with these components, among them electrical variances, changes in silver-epoxy die attach properties, delamination between plastic and leadframe parts, deformation of plastic encapsulants and plastic lenses, damage to lens coatings, and changes in the light transmission properties.

43.2.2 Assembly Temperature Profiles IPC/JEDEC2 has developed a recommended reflow profile for nonhermetic packaged semiconductor components. These recommendations are based on the temperature taken at the top side of the packaged device, and also based on package volume, excluding external leads,

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repeated for the one-eighth feeding by changing the value of l to 1/8 3 = 0375 in With the oneeighth station feeding, the width of the slot will become 23 10 4 in (58 m) The airflow for the slot-fed bearings is similar to the simple orifice feeding and can be obtained from Figure 744 The airflow of 023 cfm for Kg = 04 and the one-quarter feeding is read from the intersection of the diameter (2 in) and the length (3) This value is corrected for a supply pressure of 75 lbf/in2 [023 (75/100) = 015 cfm] For the one-eighth feeding, this value (015 cfm) is multiplied by 2 obtained from the intersection of a length-to-diameter ratio of 0125 and the curve in Figure 752 (a) The design can also be repeated for different supply pressure ratios by following the same stepby-step procedure to obtain a final design that can be manufactured within the capability of the machine and cost However, it must be remembered that the optimum supply pressure ratio is 02 The final design specification is presented in Table 74 and is shown in Figure 756 The main difference between the two types of feedings can be clearly seen in Table 75 It is obvious that the slot fed aerostatic journal bearing offers more advantages However, these advantages come at a price The manufacturing process of the slots is generally more difficult and costly Therefore, the choice depends on the particular application itself Table 74 The final design specification for slot feeding

or solder balls in the case of BGAs, and nonintegrated heat sinks. Table 43.1 lists the recommended range for Sn/Pb and Pb-free assemblies.

TABLE 43.1 Reflow Profiles Recommended for Sn/Pb and Pb-free Assemblies Based on Temperatures Taken on the Package Body Profile feature Average ramp-up rate Preheat Temperature min. Temperature max. Time Time maintained above melting Temperature Time within 5 C of peak temperature (Tp) Ramp-down rate Time 25 C to Tp Sn/Pb assemblies 3 C/sec. max. 100 C 150 C 60 120 sec. 60 150 sec. 10 30 sec. 6 C/sec. max. 6 min. max. Pb-Free assemblies 3 C/sec. max. 150 C 200 C 60 180 sec. 60 150 sec. 20 40 sec. 6 C/sec. max. 8 min. max.

The maximum recommended temperature for the package depends on the package thickness and volume. Table 43.2 lists the recommended reflow temperatures for Sn/Pb processing, whereas Table 43.3 lists the recommendations for Pb-free processing.

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