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The above piece of code shows how to read a switch and light up an LED. However, the switch interfacing is not proper. Typically, a switch, being a mechanical device, doesn t make a clean contact when it is pressed or released. Figure 6.3 illustrates the signal bounce when a mechanical switch is released. Similar bounce occurs when a switch is pressed. The bounce can last for several milliseconds as illustrated in the figure. Comparatively, the processor executes instructions much faster, up to 1000 times faster or even more. Given such a disparity, if a program were to read a switch and decide to take some action if it is pressed, then even for a single-switch press, it will end up taking the action many, many times. One cure for this problem is to use external damping components such as an RC delay circuit. A better, cost-saving method, which is more elegant, is to provide the damping in software. This software damping scheme is called debouncing the switch. The way the switch debouncing is performed is as follows: The processor reads the switch input pin, and when it detects a change of logic from 1 to 0 (for the switch configuration as illustrated in Figure 6.2), it knows that the switch has been pressed. It then calls a delay routine, which is of the order of a few milliseconds, say 20 ms (which is the

TABLE 43.2 Recommended Maximum Package Reflow Temperatures for Sn/Pb Process Package thickness <2.5 mm 2.5 mm Volume <350 mm3 240 +0/ 5 C 225 +0/ 5 C Volume 350 mm3 225 +0/ 5 C 225 +0/ 5 C

Final design dimensions: Diameter Length Diametrical Clearance Feeding Thickness of Bushing Width of Slots Radial Load Capacity Radial Stiffness Airflow 2 in (508 mm) 3 in (762 mm) 0001 in (00254 mm) Six circumferential slots at the one-eighth station 075 in (1905 mm) 23 10 4 in (58 m) 110 lbf (at e = 05), 4895 N 440 000 lbf/in (0 < e < 05), 77 000 N/mm 030 scfm (00085 m3/min)

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TABLE 43.3 Recommended Maximum Package Reflow Temperatures for Pb-Free Process Package thickness <1.6 mm 1.6 2.5 mm 2.5 mm Volume <350 mm3 260 +0 C 260 +0 C 250 +0 C Volume 350 2,000 mm3 260 +0 C 250 +0 C 245 +0 C Volume >2,000 mm3 260 +0 C 245 +0 C 245 +0 C

Surface finish is defined as the outerlayer metallization on a component or substrate being soldered. Both the type and quality of the surface finish have a major impact on surface solderability and on process soldering ability. Here, solderability is defined as the ability of the surface to be wetted by a solder, and the forming of an intermetallic layer between the solder

and the base metal. Soldering ability is defined as control of the soldering process parameters, such as a heating profile that produces that wetting action. The preference is always to have a surface that exhibits good solderability that is, ease of wetting and formation of high-quality solder interconnections for all soldering processes and materials to which it might be exposed. Soldering ability is best described as the quality of a solder process such that the operating window is wide, that is, the process is not overly sensitive to minor shifts in process parameters such as time and temperature.Thus a process with good soldering ability would be easy to control and would produce high-quality interconnections given that the incoming materials have good solderability.

Substrate Finishes The substrate surfaces of choice are usually one of the following: electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability.

Performance for a supply pressure gauge of 75 lbf/in2:

ENIG This finish is widely used because it provides a very flat surface for surface-mount component placement. It has good solderability and a long storage life but is somewhat expensive compared to other finishes. Careful control of the gold plating process during board fabrication is required to prevent a defect known as black-pad. Black-pad is caused by galvanic corrosion of the nickel layer, creating corrosion products that affect the ability of the surface to be wet with solder. If severe enough, black-pad will impact reliability of the final solder joint. ImAg Immersion silver provides a flat surface with good solderability and storage life. It is also less expensive than ENIG. However, the ImAg finish is prone to tarnish under certain atmospheric conditions; in the presence of sulfur, it forms sulfides that darken the surface and reduce solderability. OSP Organic solder preservatives are inexpensive and also provide a flat surface for surfacemount technology (SMT) placement. Storage life for OSP is less than for the metallized finishes, and multiple thermal cycles cause it to degrade. HASL One of the oldest surface finishes, HASL is based on exposing the PWB to molten solder and then removing excess solder using hot-air knives. In the lead-free world, the processing temperature is higher than for tin-lead. HASL is inexpensive, has good solderability if the solder is sufficiently thick, but has the disadvantage of not being a flat surface. ImSn This finish is similar to immersion silver in most characteristics. However, because tin tends to form metallic whiskers that can cause electrical shorts, it is not widely used.

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