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time for which the signal bounce of the switch remains). After this period, the logic on the switch has stabilized to 0 . The processor then reads the switch input again to ensure that it is still pressed. The processor then enters a software loop and monitors the switch input pin till the switch is released again. The release of the switch is characterized by the logic at the pin changing from logic 0 to logic 1 . After detecting this logic change, the processor again calls a delay routine to timeout the signal bounce on the switch and again checks if the switch has stabilized to a logic value 1 . If so, the program concludes that the particular switch was pressed and released and then can take any action as necessary. Now, before we write a piece of code to read a switch in the way just described, we need to understand how subroutines are written and called in AVR processors.

Component Surface Finishes Component surface finishes, like those of substrate finishes, are intended to provide good solderability. In the past, the majority of component leads had a tin-lead solder finish. This finish was either plated on the base metal of the component or was applied by dipping the leads in liquid metal. Given the push for lead-free assembly, most of these finishes containing lead are being replaced by alternatives. The main contenders in replacement of lead containing finishes are based on noble metals (e.g., palladium or gold) or some form of tin plating. Palladium finishes have been in use for many years and are a known commodity. However, as noted previously, the tendency of tin to form metallic whiskers as a result of stresses in the plated layer is a matter of serious concern for the electronics industry.

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Soldering3 is defined as the process of joining metallic surfaces with solder without melting the basis metal. For this joining to take place, the metal surfaces must be clean of contamination and oxidation. This cleaning action is performed by the flux,2 a chemically active compound that, when heated, removes minor surface oxidation, minimizes oxidation of the basis metal, and promotes the formation of an intermetallic layer between solder and basis metal. The soldering flux has several functions to perform. It must:

React with or remove oxide and other contamination on the surface to be soldered Dissolve the metal salts formed during the reaction with the metal oxides Protect the surface from reoxidation before soldering occurs Provide a thermal blanket to spread the heat evenly during soldering Reduce the interfacial surface tension between the solder and the substrate in order to enhance wetting

To perform these functions, soldering flux formulations contain the following types of ingredients: vehicle, solvent, activators, and other additives.

As aerostatic journal bearings are poor in taking up an axial load, there is a need for aerostatic thrust bearings This is more so for the grinding spindle where the axial stiffness is extremely crucial The practical and theoretical performances are usually different due to the underlying assumption that the pressure distribution is incompressible Aerostatic thrust bearings are more prone to a self-exciting instability and consume relatively more airflow [3] Several rules must be observed to avoid instability or an air hammer in the thrust bearing:

Vehicle The vehicle is a solid or nonvolatile liquid that coats the surface to be soldered, dissolves the metal salts formed in the reaction of the activators with the surface metal oxides, and, ideally, provides a heat transfer medium between the solder and the components or PWB substrate. Rosin, resins, glycols, polyglycols, polyglycol surfactants, polyethers, and glycerine are among the major chemicals used. Rosin or resins are selected when more benign chemicals are required since their residues are less apt to cause reliability failures. Glycols, polyglycols, polyglycol surfactants, polyethers, and glycerine are used in water-soluble flux formulations because they provide excellent wetting of the board surface and dissolve the more active materials used in these formulation.

Solvent The solvent serves to dissolve the vehicle, activators, and other additives. It evaporates during the preheat and soldering process. The solvent chosen depends upon its ability to dissolve the flux constituents for a given formulation. Alcohols, glycols, glycol esters, glycol ethers, and water are common solvents used.

Subroutine calls are interruptions in the normal sequential flow of the program. To call a subroutine, the address of the subroutine is loaded into the program counter. The processor then starts executing the code resident at this address and onwards. After the subroutine has finished, the program execution must resume from the point where it was suspended in the calling program. To do that, the processor must remember the address of the program memory from where the execution has to resume. This address is stored in a stack. A stack is a special storage area that is used to store return addresses. However, the stack is also used for passing parameters to a subroutine, if required, and to return results to the calling program. Typically, the stack is implemented in RAM and is accessed with a special register called Stack Pointer. Stack Pointer is an address register, and it indicates the address of the RAM memory location of the stack.

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